AI IntelligenceSep 8, 2026AI Intelligence
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Samsung and TSMC commit to adopting ASML High NA EUV machines by
Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.
Frontier EditorialSource: Techmeme
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Samsung and TSMC commit to adopting ASML High NA EUV machines by 2030: Samsung and TSMC have committed to adopting ASML's High NA EUV lithography machines by 2028 and 2030, respectively, joining Intel. Additionally, all four major chipmakers have agreed to transition from 6-inch to 12-inch photomasks for semiconductor production.